硕士生导师 凌味未 简介
（2025年6月16日更新）
【个人简介】
李婧，女，讲师。博士研究生学历，博士学位。近年来，在国内外高水平期刊和重要学术会议上发表论文10余篇,其中SCI收录5篇。参加多项国家自然科学基金项目等国家级纵向科研项目，承担多项企事业单位的横向项目。担任国际SCI期刊《Advanced Materials Interfaces》、《Sensors and Actuators A-Physical》等审稿专家。
【研究方向】
1. 柔性传感技术
2. 集成电路封装技术
【在研项目】
1.薄膜式传感器的柔性封装技术研究与验证，横向项目，2025.7-2025.10，负责人。
2.高密度2.5D TSV转接板的制备及应用研究，横向项目，2024.1-2025.12，负责人。
【科研成果】
一、发表论文
1. Jing Li, Hai Nie, Guoyun Zhou, et al. High-resolution temperature sensor fabricated with composed PEDOT: PSS/CuPc for electronic skin[J]. Sensors and Actuators A-Physical, 2023, 363: 114706.
2. Jing Li, Guoyun Zhou, Yan Hong, et al. Highly sensitive, flexible and wearable piezoelectric motion sensor based on PT promoted β-phase PVDF[J]. Sensors and Actuators A-Physical, 2022, 37: 113415.
3. Jing Li, Guoyun Zhou, Yan Hong, et al. A catalytic interfacing PEDOT: PSS/CuPc polymerized on cloth fiber to electro-metalize stretchable copper conductive pattern[J]. Advanced Materials Interfaces, 2021, 2101462.
4. Jing Li, Guoyun Zhou, Yan Hong, et al. Copolymer of pyrrole and 1,2-butanediol diglycidyl as an efficient additive leveler for through-hole copper electroplating[J]. ACS Omega, 2020, 5: 4868-4874.
5. Jing Xiang, Shouxu Wang, Jing Li, et al. Electrochemical factors of leverlers on plating uniformity of through-holes: simulation and experiments[J]. Journal of The Electrochemical Society, 2018, 165(9): E359-E365.
6. Zhihua Tao, Wei He, Jing Li, et al. Texraoxa-diphosphaspiro derivative as suppressor for microvia filling by copper electroplating in acidic solution[J]. Journal of The Electrochemical Society, 2017, 164(14): D1032-D1041.
7. Li Zheng, Chong Wang, Jing Li, et al. Investigation of benzoquinone as a new type of Cu electroplating additive[C]. 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2017: 231-233.
二、授权专利
1.李婧，何为，周国云，等. 一种用于直接电镀的表面处理工艺及其相关直接电镀工艺: CN201910429468.5 [P]. 2021-09-24.
2. 陶志华，何为，李婧，等. 一种用于铜互连HDI电镀填孔的抑制剂及电镀铜浴: CN201710535976.2 [P]. 2018-08-21.
【获奖情况】
1.2019年，教育部 科技进步二等奖，电子电路互连特种电子化学品关键技术及应用
【联系方式】
电子邮件：lijing1@cuit.edu.cn
